Stress Measurement Tool
Ecopia Hall Effect Measurement System
Contact Profilometers for thickness measurement
Stereo Microscopes
Compound Optical Microscopes
Four Point Probe for the measurements of sheep resistance of substrates and films
Ion milling
Annealing
Wafer dicing
CMP and Wafer Cleaner (available mid of 2018)
Sample sizes: 100 mm, 150 mm and 200 mm in diameter wafers
A primary platen to remove the material
A secondary platen to do the final polish and minimize the surface roughness
Within-wafer non-uniformity < 3 %
Wafer-to-wafer non-uniformity < 5 %