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Imaging and Analysis

Field Emission Scanning Electron Microscope (FE-SEM)

Imaging from 10 V to 30 kV
Resolution: 0.8 nm at 15 kV; 1.2 nm at 1 kV
Magnification: 25 times to 1,000,000 times
The FESEM has 4 detectors:
In lens secondary detector and Everhart Thornley secondary detector
Energy selective secondary/backscattered electron detector for topography/compositional contrast imaging at low voltages
Retractable backscatter detector for composition contrast imaging
Aperture Control lens that automatically optimizes the probe current and beam size depending on the imaging conditions
Beam deceleration mode to reduce charging of non-conducting specimens
Motorized stage with travel in 5 axes
Integrated 200 mm airlock for fast sample changes

Scanning Transmission Electron Microscope (STEM)

Acceleration voltage range: 80 kV to 300 kV with preset alignment for 80 kV, 200 kV, and 300 kV
Scanning transmission electron microscopy mode
Convergent beam and selected area electron diffraction modes
Conventional TEM modes
Point-to-point spatial resolution in TEM mode: 0.20 nm at 300 kV
STEM resolution: 0.136 nm at 300 kV
Super-twin objective lens pole piece
Gatan Orius digital camera (2000 x 2000 pixels)
Fischione high angle annular dark field STEM detector for Z-contrast imaging
Gatan QuantumSE™ energy filter for electron energy loss spectroscopy and energy-filtered TEM; filter energy spread: 0.8 eV
EDAX Si(Li) x-ray energy-dispersive spectrometer; energy resolution: 0.136 eV
Tomography acquisition, reconstruction, and analysis software
Analytical, heating, cooling, and tomography specimen holders

High Resolution Atomic Force Microscope

Phase imaging, contact mode, and tapping mode
Electrostatic force microscopy
Magnetic force microscopy
Sample characterization in liquid
X-Y scan range: 35 µm x 35 µm
Z range: 6 µm
User customizable software and hardware inputs
Viscoelastic mapping of mechanical properties
Nanoscale mechanical properties for diverse materials
Force spectroscopy
Surface roughness measurements
Electrical measurements
Piezoresponse force mapping

X-Ray Diffraction

9 kW rotating anode x-ray generator
X-ray generator ranges: 20 kV to 45 kV; 10 mA to 200 mA
Scintillation point detector and a high-speed position sensitive detector system
Five axis high resolution goniometer with an Eulerian cradle, X-Y-Z sample stage
Parallel beam optics with a multi-layer X-ray mirror
Bragg Brentano focusing optics
Computer controlled variable divergence slit, variable anti-scatter slit, and receiving slit
Germanium (220) 2-bounce and 4-bounce channel cut monochromators, and a germanium (220) 2-bounce analyzer
Anton Paar domed hot stage for high temperature measurements of up to 1100 oC in air, vacuum, or inert gas

FE-SEM and FIB

FE-SEM

Resolution: sub-nanometer from 1 kV to 30 kV
High resolution triple in-lens electron detectors with Through Lens (TLD, secondary and backscatter mode), In Column (ICD, low-loss backscatter), and Mirror (MD, no-loss backscatter) detectors
Scanning transmission electron microscopy (STEM) detector with bright-field (BF), dark-field (DF), and high-angle annular dark-field (HAADF) segments
Electron beam deceleration for 50 V effective landing voltage
5-axis stage with 150 mm X-Y range and full rotation
Integrated plasma cleaner to minimize contamination

FIB (Gallium ion source)

Resolution: 2.5 nm at 30 kV
High current for fast milling of large areas
High efficiency secondary ion detector
Electron flood gun for ion charge compensation
Integrated beam current measurement to allow faster ion beam calibrations while samples are already in the chamber
Real time monitoring of milling and deposition processes
End point monitoring for cross sectioning and circuit editing applications
Oxford/Omniprobe 300 manipulator for removing transmission electron microscopy (TEM) samples
Enhanced capabilities for simultaneous chemical characterization using energy dispersive x-ray spectroscopy on an Oxford Instruments X-Max 80 mm2 SDD-EDS detector and material crystallographic characterization using electron backscatter diffraction on an Oxford Instruments NordlysMax2 EBSD detector
Gas injection system chemistries
Platinum deposition
Carbon deposition
Insulator deposition using tetraethyl orthosilicate (TEOS)
Selective carbon etch
Insulator enhanced etching using xenon difluoride (XeF2)



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