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测量和后道工艺

Stress Measurement Tool

Ecopia Hall Effect Measurement System

Contact Profilometers for thickness measurement

Stereo Microscopes

Compound Optical Microscopes

Four Point Probe for the measurements of sheep resistance of substrates and films

Ion milling

Annealing

Wafer dicing

CMP and Wafer Cleaner (available mid of 2018)

Sample sizes: 100 mm, 150 mm and 200 mm in diameter wafers

A primary platen to remove the material

A secondary platen to do the final polish and minimize the surface roughness

Within-wafer non-uniformity < 3 %

Wafer-to-wafer non-uniformity < 5 %



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