Field Emission Scanning Electron Microscope (FE-SEM)场发射扫描电子显微镜

● Imaging from 10 V to 30 kV

● Resolution: 0.8 nm at 15 kV; 1.2 nm at 1 kV

● Magnification: 25 times to 1,000,000 times

● The FESEM has 4 detectors:

1）In lens secondary detector；

2）Everhart Thornley secondary detector；

3）Energy selective secondary/backscattered electron detector for topography/compositional contrast imaging at low voltages；

4）Retractable backscatter detector for composition contrast imaging；

● Aperture Control lens that automatically optimizes the probe current and beam size depending on the imaging conditions

● Beam deceleration mode to reduce charging of non-conducting specimens Motorized stage with travel in 5 axes

● Integrated 200 mm airlock for fast sample changes

Scanning Transmission Electron Microscope (STEM)扫描透射电子显微镜

● Acceleration voltage range: 80 kV to 300 kV with preset alignment for 80 kV, 200 kV, and 300 kV

● Scanning transmission electron microscopy mode

● Convergent beam and selected area electron diffraction modes

● Conventional TEM modes

● Point-to-point spatial resolution in TEM mode: 0.20 nm at 300 kV

● STEM resolution: 0.136 nm at 300 kV

● Super-twin objective lens pole piece

● Gatan Orius digital camera (2000 x 2000 pixels)

● Fischione high angle annular dark field STEM detector for Z-contrast imaging

● Gatan QuantumSE™ energy filter for electron energy loss spectroscopy and energy-filtered TEM; filter energy spread: 0.8 eV

● EDAX Si(Li) x-ray energy-dispersive spectrometer; energy resolution: 0.136 eV

● Tomography acquisition, reconstruction, and analysis software

● Analytical, heating, cooling, and tomography specimen holders

High Resolution Atomic Force Microscope高分辨率原子力显微镜

● Phase imaging, contact mode, and tapping mode

● Electrostatic force microscopy

● Magnetic force microscopy

● Sample characterization in liquid

● X-Y scan range: 35 µm x 35 µm

● Z range: 6 µm

● User customizable software and hardware inputs

● Viscoelastic mapping of mechanical properties

● Nanoscale mechanical properties for diverse materials

● Force spectroscopy

● Surface roughness measurements

● Electrical measurements

● Piezoresponse force mapping

X-Ray DiffractionX射线衍射

● 9 kW rotating anode x-ray generator

● X-ray generator ranges: 20 kV to 45 kV; 10 mA to 200 mA

● Scintillation point detector and a high-speed position sensitive detector system

● Five axis high resolution goniometer with an Eulerian cradle, X-Y-Z sample stage

● Parallel beam optics with a multi-layer X-ray mirror

● Bragg Brentano focusing optics

● Computer controlled variable divergence slit, variable anti-scatter slit, and receiving slit

● Germanium (220) 2-bounce and 4-bounce channel cut monochromators, and a germanium (220) 2-bounce analyzer

● Anton Paar domed hot stage for high temperature measurements of up to 1100 oC in air, vacuum, or inert gas

FE-SEM and FIB场发射扫描电子显微镜与聚焦离子束

FE-SEM

● Resolution: sub-nanometer from 1 kV to 30 kV

● High resolution triple in-lens electron detectors with Through Lens (TLD, secondary and backscatter mode), In Column (ICD, low-loss backscatter), and Mirror (MD, no-loss backscatter) detectors

● Scanning transmission electron microscopy (STEM) detector with bright-field (BF), dark-field (DF), and high-angle annular dark-field (HAADF) segments

● Electron beam deceleration for 50 V effective landing voltage

● 5-axis stage with 150 mm X-Y range and full rotation

● Integrated plasma cleaner to minimize contamination

FIB (Gallium ion source)

● Resolution: 2.5 nm at 30 kV

● High current for fast milling of large areas

● High efficiency secondary ion detector

● Electron flood gun for ion charge compensation

● Integrated beam current measurement to allow faster ion beam calibrations while samples are already in the chamber

● Real time monitoring of milling and deposition processes

● End point monitoring for cross sectioning and circuit editing applications

● Oxford/Omniprobe 300 manipulator for removing transmission electron microscopy (TEM) samples

● Enhanced capabilities for simultaneous chemical characterization using energy dispersive x-ray spectroscopy on an Oxford Instruments X-Max 80 mm2 SDD-EDS detector and material crystallographic characterization using electron backscatter diffraction on an Oxford Instruments

● NordlysMax2 EBSD detector

● Gas injection system chemistries

● Platinum deposition

● Carbon deposition

● Insulator deposition using tetraethyl orthosilicate (TEOS)

● Selective carbon etch

● Insulator enhanced etching using xenon difluoride (XeF2)