● Stress Measurement Tool

● Ecopia Hall Effect Measurement System

● Contact Profilometers for thickness measurement

● Stereo Microscopes

● Compound Optical Microscopes

● Four Point Probe for the measurements of sheep resistance of substrates and films

● Ion milling

● Annealing

● Wafer dicing

● CMP and Wafer Cleaner (available mid of 2018)

Sample sizes: 100 mm, 150 mm and 200 mm in diameter wafers

A primary platen to remove the material

A secondary platen to do the final polish and minimize the surface roughness

Within-wafer non-uniformity < 3 %

Wafer-to-wafer non-uniformity < 5 %